Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas state to a solid state on a substrate, utilizing plasma to enhance the chemical reaction rates. This technique allows for deposition at lower temperatures, which is particularly beneficial for substrates that cannot withstand high temperatures and is widely used in semiconductor and photovoltaic industries.
Film uniformity and adhesion are critical attributes of thin film coatings in various applications, impacting their performance, reliability, and longevity. Achieving optimal results involves controlling deposition processes and understanding substrate interactions to ensure consistent thickness and strong adherence across the surface.
Photovoltaic device fabrication involves the creation of solar cells that convert sunlight directly into electricity via the photovoltaic effect. Key aspects of this process include material selection, layer deposition, and patterning to optimize efficiency and durability while minimizing costs.