Through-Hole Technology (THT) is a method of mounting electronic components on a printed circuit board (PCB) where component leads are inserted into holes drilled through the board and soldered to pads on the opposite side. It offers strong mechanical bonds and is ideal for components that require high reliability and durability, although it is less suitable for high-density applications compared to Surface-Mount Technology (SMT).

Through-Hole Technology

mounting electronic components

A printed circuit board (PCB) is a foundational component in electronics, providing mechanical support and electrical connections for electronic components through conductive pathways etched from copper sheets laminated onto a non-conductive substrate. PCBs are essential for the miniaturization and functionality of modern electronic devices, playing a critical role in the manufacturing and assembly of complex circuits.

printed circuit board

Component leads are responsible for overseeing specific parts of a project or system, ensuring that their components are developed, integrated, and function as intended within the larger framework. They act as the primary point of contact for their component, coordinating with other leads and team members to align on goals, timelines, and technical requirements.

component leads

Soldered pads

mechanical bonds

high reliability

Durability refers to the ability of a material or product to withstand wear, pressure, or damage, ensuring its longevity and continued functionality over time. It is a critical factor in product design and material selection, impacting sustainability, cost-effectiveness, and consumer satisfaction.

durability

High-Density Applications refer to software systems designed to efficiently manage and process large volumes of data or transactions within constrained resources, often leveraging advanced algorithms and data structures. These applications are crucial in environments like cloud computing, telecommunications, and financial services where performance, scalability, and resource optimization are paramount.

high-density applications

Surface-Mount Technology (SMT) is a method for producing electronic circuits where components are mounted directly onto the surface of printed circuit boards (PCBs). This technology allows for higher circuit densities, smaller components, and automated assembly, significantly improving manufacturing efficiency and performance.

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