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Concept
Reflow Oven
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Summary
A
Reflow Oven
is a specialized piece of equipment used in the
Electronics manufacturing process
to
Solder surface mount components
onto
Printed Circuit Boards
(PCBs) by
Melting solder paste
. It operates through a
Controlled heating process
that involves preheating, soaking, reflow, and
Cooling stages
to ensure
Proper soldering
and
Avoid defects
.
Concepts
Surface Mount Technology
Printed Circuit Board
Solder Paste
Thermal Profiling
Convection Heating
Infrared Heating
Reflow Soldering
Temperature Control
Solder Joint Reliability
Electronics Manufacturing
Relevant Degrees
Electrical Engineering 50%
Machining and Working with Chips 30%
Mechanical Technology 20%
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