Step coverage refers to the uniformity of a thin film material deposited over a substrate with topographical features, such as steps or trenches. It is crucial in semiconductor manufacturing, as poor step coverage can lead to device failure due to incomplete or uneven material deposition in critical areas.

Step Coverage

Thin film material

A substrate is the underlying substance or layer that supports or is the surface on which an organism grows or is attached, or it is the substance on which an enzyme acts in biochemical reactions. Understanding substrates is crucial in fields such as biology, chemistry, and environmental science as they influence the behavior and interaction of organisms and reactions.

Substrate

Topographical features

Semiconductor manufacturing is the complex process of producing semiconductor devices, which are essential components in modern electronics. It involves multiple stages including wafer fabrication, photolithography, doping, etching, and packaging, requiring precision and advanced technology to achieve high efficiency and miniaturization.

Semiconductor Manufacturing

Device failure

Material deposition is a process used in manufacturing and materials science to add layers of material onto a substrate, enabling the creation of thin films, coatings, or complex structures. This technique is crucial in various industries, including electronics, aerospace, and biomedical applications, for enhancing surface properties or building intricate devices layer by layer.

Concepts

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